In the advanced realm of PCB design, efficiency in space utilization is paramount. As engineers strive for more compact and high-performance devices, traditional through-hole vias often fall short in achieving the required interconnect density. This is where High-Density Interconnect (HDI) design plays a crucial role. HDI allows for the integration of more functionality within smaller footprints by utilizing advanced via technology, including micro vias, blind vias, and buried vias.
Blind vias start at one of the outer layers of the PCB and extend to an inner layer. They are particularly useful for connecting surface-mounted components to inner layers without necessitating traces that traverse the entire board. Blind vias can be drilled after board assembly, although they can also be manufactured before the layers are connected.
As the name suggests, buried vias are completely confined within the inner layers of the PCB. They are essential for connecting internal layers without consuming surface real estate, making them highly functional for dense designs. Typically, buried vias are drilled before the board undergoes complete assembly.
Micro vias are exceptionally small and have diameters ranging from 25 to 150 micrometers. These vias typically require laser drilling for precision. However, the diameter is confined by the hole depth-to-hole diameter aspect ratio, with different manufacturers having varying capabilities regarding PCB production.
Vias can be organized in two main configurations:
Now that we have a solid grasp of the different types of vias, let’s delve into how to effectively manage them in Flux.
In the stackup editor, you can manage layers as well as via configurations:
The position of the via configurations from left to right determines their priority during routing. Flux will utilize the highest priority via for connections unless specified otherwise.
You can place smart vias in several ways during routing:
In Flux, you can alter the type of via a smart via uses without needing to adjust the via prioritization manually. By selecting the smart via, you can change its properties in the options toolbar, allowing Flux to automatically switch to the next highest priority via that fulfills the necessary electrical connection.
This setup allows for highly efficient workflows in compact designs, greatly enhancing productivity and reducing design times.
The main types of vias are blind vias, buried vias, and micro vias.
Go to your profile, select "New Project," and choose to create a blank project.
HDI designs allow for higher interconnect densities, enabling more functionality in smaller board footprints.
The prioritization of vias is determined by their position in the via configurations, arranged from left to right.
Yes, you can modify the via type directly in the options toolbar by selecting the smart via and adjusting its properties.
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